Announcing and inviting you to apply to share your innovation at TechCon2016!

We are pleased to announce TechCon 2016 a convening scheduled November 10-12, 2016 at Massachusetts Institute of Technology (MIT), in the Boston area USA.

TechCon 2016 will explore the growing emphasis on the importance of innovation in local communities to solve development challenges. TechCon 2016 will also host the Higher Education Solutions Network (HESNÔÇÖs) 3rd Innovation Marketplace. The Innovation Marketplace is a competition showcasing the talent of students and young researchers and innovators who are using science, technology, innovation, and partnerships (STIP) to tackle global challenges.

This year, teams or individuals can compete in one of two categories: 1) research or 2) products & services. Products & Services include approaches, technologies, devices, or systems with at least an existing prototype by the time of submission. Research includes projects or methodologies that have collected preliminary data by the time of submission.

Application Process

Apply through Makerere University School of Public Health ResilientAfrica Network (RAN) and enjoy the following benefits;
┬À Additional support to your application and video development. Capacity building for ONLY successful candidates who apply before April 29, 2016,
┬À Modest/limited financial travel support to ONLY selected successful applicants.
┬À Apply here
┬À All these applications are due April 29, 2016 11:59 pm EAT

For inquiries, please email Harriet Adong (hadong@ranlab.org and info@ranlab.org) and Brian Ndyaguma (bndyaguma@ranlab.org).

Apply Directly to the Higher Education Solutions Network (HESN).
┬À All applications will be housed on the Global Innovation Exchange
┬À All applications are due by May 31, 2016

The broader guidelines are shared here

For details please visit Innovation Marketplace landing page on the Exchange. If you have questions or concerns, please feel free to email Althea Lyness-Fernandez (alynessfernandez@usaid.gov) and Brian Bingham (bbingham@usaid.gov).

The team is excited to see what innovations this yearÔÇÖs TechCon brings!

Previous stories shared here http://www.ranlab.org/?s=TechCon.